OPRFID Technology: As its name implies, the Internet of things is “the Internet connected with things”. It can be said that it is one of the most prominent technical trends in recent years. It is an extended and extended network based on the Internet. Its client extends and extends to any object for information exchange and communication.
With the continuous accumulation and upgrading of Internet of things technology, its industrial chain has gradually improved and matured. In addition, affected by infrastructure construction, transformation of basic industries and consumption upgrading, fields and industries at different development levels continue to promote the development of Internet of things alternately, driving the overall explosive growth trend of the global Internet of things industry.
At present, the era of Internet of all things has slowly begun. Products with a sense of science and technology, such as smart home, smart wear, smart security, automobile auto drive system, have emerged one after another and entered people’s vision.
Imagine that when your house has been equipped with a smart home system, it can automatically adjust the appropriate water temperature and air conditioning temperature according to the weather and temperature, and automatically adjust the most appropriate light brightness according to the owner’s personal habits. When the host goes out, the system automatically enters the standby energy-saving mode. Like a well-trained soldier, it receives every message and executes every instruction in an orderly manner, integrates the facilities related to home life, constructs an efficient management system of residential facilities and family schedule affairs, and creates a living environment that takes into account convenience, comfort and environmental protection and energy conservation. Such a home life, even in today’s rapid development of science and technology, still has a full sense of the future, and all this is inseparable from the support of Internet of things technology. Unconsciously, Internet of things technology is or has profoundly changed our living conditions and thinking habits.
The application scenarios involved in Internet of things technology can be extended to all aspects of various industries. The successful implementation of various Internet of things devices requires massive data support, and the computing demand of devices will grow exponentially. Today, when Moore’s law approaches the limit, how to continue Moore’s law has become a major challenge for the semiconductor industry.
Advanced packaging is one of the key technologies to continue Moore’s law and promote further breakthroughs in the semiconductor field. Chips with high computing, high transmission, low delay and low energy consumption will play an irreplaceable value in Internet of things devices. The packaging method of chips will affect other aspects of chip design. Small changes inside the package are enough to greatly change the electronic or temperature characteristics of the packaging system. Advanced packaging technology can effectively improve chip efficiency, reduce power consumption, improve area, and add functions and capabilities. If we want the development of the Internet of things to reach the expected scale, packaging technology is bound to provide corresponding support.
With the increasing demand of consumers for intelligent devices that can realize sensing, communication and control applications, MEMS and sensors are becoming a very key packaging method because of their smaller size, thinner shape and function integration ability. MEMS and sensors can be widely used in many systems in communication, consumer, medical, industrial and automotive markets, which greatly promotes the development of Internet of things technology.
With the advent of the post Moore era, many innovative application scenarios of the Internet of things have rapidly promoted the upgrading of advanced packaging and chip finished product manufacturing technology, and provided new historical development opportunities for Changdian technology. Changdian technology has been deeply cultivated in the semiconductor field for many years and has deep technical precipitation and unique insights into the semiconductor packaging field. With our technical combination and professional MEMS team, Changdian technology can provide a complete one-stop service for the manufacturing of finished chip products. Our innovative integrated solutions can help your enterprise meet the size, performance and cost requirements of MEMS and sensor applications, and effectively help customers stand out in the field of Internet of things with the rapid expansion of the market and increasingly homogeneous competition in recent years.
At present, together with global customers, Changdian technology continues to increase investment in advanced technology, strengthen professional and international enterprise management and production operation system, increase R&D investment in advanced technology, optimize operation capacity, and strengthen professional team construction, so as to lay a solid foundation for the sustainable development of Changdian technology and contribute to the development of science and technology in the world.
Nowadays, the Internet of things covered by a vast network provides soil for the development of “packaging technology”. The market is broad and the technology is becoming more and more mature. Changdian technology has been involved in this wave of building an intelligent society. We will be committed to providing advanced and reliable manufacturing technology and services for finished products of integrated circuit devices for smart life, and contribute to the development of semiconductor development and Internet of things technology at home and abroad.